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Sauce Pouch Wins 2005 Aluminium Foil Award

Alcan Takes Two Golds, One Silver at Annual Flexible Packaging Association Achievement Awards

ExxonMobil to Increase Santoprene Production Capacity

3M Introduces Thinner Embedded Capacitance Material for High-Performance Circuit Boards

Degussa to Expand Carbon Black Capacity at Brazillian Plant

Hitachi Chemical to Spend $10m to Add Another Semiconductor Production Base in China

Helvoet Acquire Philips High Tech Plastics Automotive

CSMA Invest in ToFSIMS to Boost Surface Analysis Capabilities

Malvern To Launch New Particle Shape Analyzer At Pittcon 2005

Veeco Introduces New High Performance Optical Profiler for Printed Electronics Applications

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