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Bruker Launches Advanced In-Situ Nanomechanical Test Instrument for Analyzing Materials Deformation in Electron Microscopes

The Bruker Nanomechanical Testing business today announced the release of the Hysitron PI 89 SEM PicoIndenter™ to provide nanomechanical testing capabilities inside a scanning electron microscope (SEM) at higher loads and in more extreme environments than previously possible.

From Bruker Nano Surfaces and Metrology 14 Oct 2020

Techsil & Panacol Offer a New Adhesive for Filament Winding Processes

The newly developed Vitralit® UD 1405 adhesive is an innovative adhesive system for fibre and filament winding. For high efficiency, Vitralit® UD 1405 can be applied during the winding process and immediately cured with high intensity LED curing systems.

14 Oct 2020

Indium Corporation Announces Low-Temp Solder Seminar at LEAP Expo

Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China.

From Indium Corporation 14 Oct 2020

MaRCTech2, Inc. Announces that GlobalTech Plastics Adds 1200-Ton Molding Machine

MaRCTech2, a leading supplier of materials and components to a wide range of manufacturers on the West Coast, announces that GlobalTech, its plastic injection molding partner, has added a 1200-ton molding machine to their long list of equipment.

13 Oct 2020

Misa – A New, Portable Food Analysis System

Metrohm is proud to announce the launch of the Misa – its first handheld solution to detect and identify trace level food contamination in the field.

From Metrohm USA Inc. 9 Oct 2020

Renishaw Introduces New Particle Analysis module

Renishaw has introduced the Particle Analysis software module for its inVia™ confocal Raman microscope. The module automates the inVia microscope so that it can identify particles on images and then chemically analyse them using Raman spectroscopy.

From Renishaw plc - Spectroscopy 6 Oct 2020

Panacol and Hönle Develop New System Solution for Filament Winding Processes

With the newly developed Vitralit® UD 1405 adhesive, Panacol has created an innovative adhesive system for fibre and filament winding.

From Hoenle AG 2 Oct 2020

Bruker Releases Suite of Benchtop 3D Optical Profiler Systems

Bruker today announced the release of its next-generation benchtop ContourX 3D Optical Profilometers for gage-capable surface texture and roughness metrology in R&D and manufacturing environments.

From Bruker Nano Surfaces and Metrology 1 Oct 2020

ORPHEUS-MIR – The Source for Broadband Mid-IR Pulses

The largest manufacturer of femtosecond optical parametric amplifiers (OPAs), LIGHT CONVERSION launched an ultrafast source based on OPA technology for broadband mid-IR pulses – ORPHEUS-MIR.

29 Sep 2020

Toshiba Launches Ultra-Low Current Consumption CMOS Operational Amplifier That Contributes to Longer Operating Hours of Battery-Operated Devices

Toshiba Electronic Devices & Storage Corporation has added “TC75S102F,” a new CMOS operational amplifier featuring industry-leading[1] ultra-low current consumption to its lineup. Shipments start today.

29 Sep 2020

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