During a ceremony at San Jose City Hall, the U.S. Environmental Protection Agency and the Green Electronics Council recognized an elite group of pioneering organizations for using EPEAT, the Electronic Product Environmen...
The TXFOAM project, initiated by GAIA (the Association of Information Technologies’ Industries in the Basque Country), ESTIA (École Supérieure des Technologies Industrielles Avancées) and the Univers...
Cookson Group plc (“Cookson”), a leading materials science company, today announces three new expansion projects in China and a further rationalisation project in the US, which will combine further to enhance...
Silicon-materials leader Dow Corning Corp. today announced a $50 million investment in new equipment for its Midland, Mich., plant that is expected to reduce carbon dioxide emissions by 20 percent, total emissions by 75 ...
MATERIAL has become official technology partner for the Belgian Umicore Solar Race Team. The team will participate in the 2007 Panasonic World Solar Challenge across Australia on October 21-28, 2007.
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The world’s largest and most respected conference, supporting PVC across the world through information, education,debate and discussion.
For the tenth PVC Conference in 2008 the successful format of our previous...
Mercury air emissions will continue to decline thanks to a voluntary national program to remove mercury-containing switches from vehicles headed for scrap. In its first year, more than 635,000 switches have already been ...
GE Energy has signed a multi-million dollar contract with Wuhan Iron and Steel Company, Ltd. of Wuhan, China for GE's first large-size blast furnace gas (BFG)-fired combined-cycle power generation project in China.
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BASF, RWE Power and the Linde Group have agreed today on the development of new processes for CO2 capture from combustion gases in coal-fired power plants. The cooperation will comprise the construction and operation of ...
With the help of a device capable of depositing metals an atom at a time in the materials used in computer chips, a team of University of Wisconsin-Madison engineers has successfully blended modern semiconductor technolo...
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