Posted in | Materials Testing and Characterisation

The EM TIC 3X Milling System from Leica Microsystems

The EM TIC 3X Milling System surpasses conventional slope cutting instruments. It can mill at high rates, cut broad and deep into the sample, and create smooth surfaces resulting in high-quality cross-sections of almost any material, quickly and easily.

Run-time 4:19mins

The EM TIC 3X Milling System from Leica Microsystems

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