Posted in | Materials Testing and Characterisation

The EM TIC 3X Milling System from Leica Microsystems

The EM TIC 3X Milling System surpasses conventional slope cutting instruments. It can mill at high rates, cut broad and deep into the sample, and create smooth surfaces resulting in high-quality cross-sections of almost any material, quickly and easily.

Run-time 4:19mins

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Leica Microsystems Ergonomy

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A New Era In 3D Scanning

Creaform’s next generation of portable 3D scanners offers unprecedented speed, accuracy, and ease of use for each stage of your product lifecycle management.In this interview, Guillaume Bull, Product Manager from Creaform talks to AZoM about their new portable 3D scanner.

A New Era In 3D Scanning