Posted in | Materials Processing

TTV Bow Warp Measurement

TTV Bow Warp Measurement means that a top and bottom sensor simultaneously measure topography and thickness of the wafer. In this application video, yhey show you the typical steps of a TTV Bow Warp recipe: thickness calibration, full wafer mapping, full wafer thickness map in 3D view, fast profile scans and the profile measurement preview, fast point measurement and point measurement preview, as well as the automatic reporting of measurement results and data charts.

Run time: 1:39min 

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