Oberg Industries introduces Molecular Decomposition Process™ (MDP™), an advanced grinding technology developed for removal or cutting of any conductive material. MDP uses an electrochemical action and an abrasive wheel to achieve surface finish of less than 1 RA and precision tolerances held to ± 0.0002" - all without generating heat.
The process is used for consumer or industrial products where surface finish and dimensional stability are imperative such as grinding surgical needles, sharps and razor blades. Molecular Decomposition Process is also suitable for applications requiring a surface free of micro cracks and fissures or other highly polished weight bearing and articulating surfaces. Gentle enough to grind thin-walled components without damage or distortion, MDP works well with tubing, rapid cut-off needs and grinding of complex features in exotic metals including nitinol.
During Molecular Decomposition Process, an electric current flows between the negatively charged abrasive wheel and the positively charged work piece through an environmentally friendly electrolyte (saline) solution. A decomposing action occurs causing the material surface to oxidize. This oxidized surface is then removed by the specially formulated abrasives in the wheel exposing more material and repeating the cycle.
MDP cuts conductive materials 80 percent faster than conventional methods and is especially effective on super-alloys and exotic metals. It can be used with aluminum, beryllium, cobalt chrome, copper, Inconel, Iridium, Molybdenum, nickel, Nitinol, platinum, Rhenium , single crystal alloys, stainless steel, titanium, titanium carbide, tungsten carbide, zirconium and other conductive ceramics and plastics.
After working closely with Compositron Corporation, based in Brooklyn, NY, for over five years to further develop and refine the Molecular Decomposition Process, Oberg acquired the MDP technology and the full consumable products line of Voltron™ grinding wheels and electrolyte. Voltron grinding wheels and electrolytic solution continue to be manufactured and developed at Oberg's Sarver, PA, campus to fit a variety of cutting and grinding applications.