Nanophase technologies (NT) and Rodel have formed a strategic partnership and agreed on a long term exclusive supply arrangement. Together they will combine NT’s nanoparticle technology with Rodels patented chemistry to develop and market a new range of chemical mechanical polishing (CMP) slurries for the semiconductor industry.
CMP is the process for removing uneven surfaces from the surface of a wafer to create a flat substrate. It employs chemical material removal made possible by a fluid, combined with a mechanical effect, using inorganic abrasive particles. The process enables more accurate photolithography and is critical in the production of increasingly smaller semiconductors.
NT’s technology is a key to producing improved CMP materials as they are able to produce materials with a very narrow particle size distribution.
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