Dow Corning’s Newest Conductive Grease Breaks Thermal Performance

Dow Corning Corporation has introduced DOW CORNING® TC-5022, a new thermally conductive grease that offers a step-change in thermal performance and cost of ownership for high-end microprocessor packages. TC-5022 is the latest material to emerge from Dow Corning’s broad family of thermal interface materials, which includes a growing line of conductive greases.

Used as the thermal “path” between a flip-chip microprocessor package and its device-cooling heat sink, TC-5022 thermally conductive grease has been shown to offer a 10-15 percent improvement in thermal performance over other thermal grease options on the market today, according to customer testing. The grease can be used with a wide range of heat sink options, including lower cost heat sinks that enable users to reduce overall manufacturing costs.

“As high-end chipsets and graphic processors trend toward ever-faster clock speeds, our customers continue to wrestle with a need for better thermal management in the latest generations of package designs,” said Tom Cook, global industry executive director, Dow Corning. “Offering unparalleled heat dissipation and cost-of-ownership benefits, TC-5022 already is gaining traction with companies throughout the value chain – from desktop and device makers to heat sink companies and contract manufacturers.”

TC-5022 allows manufacturers to achieve low thermal resistance (0.07cm2C/W) with thin bond lines (<25 microns). The material offers long-term thermal stability and enables pressure-independent processing, giving users a wide process window to improve manufacturing consistency, repeatability and overall yield.

Thermal greases and other thermal interface materials are a critical consideration in the design and development of the newest generations of flip-chip processor packages, which have more complex heat management challenges than their predecessors. In addition to thermally conductive greases, Dow Corning offers an extensive line of thermal interface materials, including pads, films and gels, to meet the electronics industry’s broad range of heat-management needs.

Posted 15th March 2005

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