Dow Corning Introduces Dispensable Thermal Pads for Cost-Effective Thermal Management of Electronics

Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced new Dow Corning® Dispensable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electronics targeting LED lamp and luminaires, data servers, telecommunications equipment and transportation applications.

The new materials enable manufacturers to quickly and precisely print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex substrates while ensuring excellent thermal management properties and reduced manufacturing cost.

“This new addition to Dow Corning’s extensive portfolio of thermal management silicone solutions is an example of how we pay close attention to industry-wide trends, and leverage our institutional expertise to design materials and manufacturing solutions that meet our customers’ most pressing challenges,” said Margaret Servinski, global manager for Thermal Management Materials, Dow Corning. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified manufacturing, and improved heat management – all promoting a lower total cost of ownership for finished electronics products.”

Dow Corning’s new technology offers the potential to reduce material costs by 30 to 60 percent by eliminating waste more common to conventional fabricated thermal pads. They also enhance thermal performance and accelerate manufacturing cycles. The materials can be applied via standard screen or stencil print processes, or by using standard dispensing equipment. Either way, Dispensable Thermal Pads easily conform to complex and unevenly shaped substrates and cure in place to help increase throughput and provide greater flexibility over deposited layer thickness.

Dow Corning’s new line encompasses four products, distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses.

Dow Corning® TC-4015 and Dow Corning® TC-4016 Dispensable Thermal Pads offer thermal conductivity of 1.5 W/mK, and Dow Corning® TC-4025 and Dow Corning® TC-4026 Dispensable Thermal Pads offer higher 2.5 W/mK thermal conductivity. Two grades, Dow Corning TC-4016 and
Dow Corning TC-4026 Dispensable Thermal Pads, incorporate glass beads to offer improved control over bond line thickness.

All products in the company’s new line bond well with common electronics substrates like aluminum and printed circuit boards. Plus, because they eliminate the fiberglass carrier used for conventional fabricated pads, Dow Corning’s solution offers lower thermal resistance, excellent compression and consistently reliable, high-quality thermal management over the lifetime of a product.

Dow Corning Dispensable Thermal Pads are available from Dow Corning worldwide.

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