Nordson MARCH, a Nordson® company and global leader in plasma processing technology, will present two papers at The Electrochemical Society (ECS) and Sociedad Mexicana de Electroquímica (SMEQ) Joint International Meeting being held at the Moon Palace Resort, Cancún, México on October 7, 2014 during Session P4.
David Foote, Nordson MARCH global applications manager, will present Overcoming High Performance Semiconductor Packaging Challenges Using Plasma at 10:40 AM and Plasma Solutions for Life Sciences and Medical Device Manufacturing at 11:20 AM as part of the General Plasma Processes session in the Expo Center on the 1st floor, Universal 5.
According to Foote, plasma is useful for both the manufacturing process of the packages as well as in the assembly of the package. Optimized plasma processes enable three-dimensional packaging technologies that are both useful and reliable. Plasma is also beneficial for flip-chip packaging, for pretreatment prior to wire bonding, for robust and reliable bonds on advanced packages with very thin metal stacks for bonding, and for silicon stress reduction following wafer thinning and/or dicing.
In the medical device industry plasma treatment can solve challenges due to issues with bio-compatibility, material mismatch, implant duration, ability to withstand sterilization, wettability, lubricity, and such. Specific application examples will be presented showing the many uses and benefits of plasma processing for semiconductor packaging and of plasma processing for medical devices during these sessions.
Foote has an extensive background in chemical vapor deposition (CVD) with a focus on plasma enhanced CVD. He holds a B.S. degree in chemical engineering from the University of Cincinnati and has been granted over 35 patents.
To register, visit the ECS / SMEQ symposium website. For more information, contact Nordson MARCH at [email protected] or visit us on the website at www.nordsonmarch.com.