Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, will exhibit at Semicon Europa, scheduled to take place Oct. 25-27, 2016 in Grenoble, France. Company representatives will showcase both liquid and dry-film negative photoresist for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation).
These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry film) and processing on MEMS and IC wafers.
Dry films are available in thickness formats from 5 to 100um, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The EMS resists are tougher (less brittle) than most negative photo resists on the market and are hydrophobic in nature, providing for chemical and moisture resistance. The dry films are compatible with and can be used in contact with the EMS line of spin coatable photoresists.
Please stop by the Engineered Materials Systems’ booth #537 to discuss the company’s full line of film and liquid negative photo resists formulated for fabricating microfluidic channels and sealing through silicon vias.
For more information about the liquid and dry film negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.