Jan 3 2007
Oxford Instruments, the high-technology tools and systems company, has developed a new TEOS delivery module for plasma-enhanced chemical vapour deposition (PECVD) of silicon dioxide (SiO2) in its Plasmalab®System100 and PlasmalabSystem133 deposition tools. TEOS (tetraethoxysilane, tetraethyl orthosilicate) offers an alternative PECVD precursor to the commonly-used silane (SiH4) for applications such as photonics and dielectric layers in which high quality, conformal deposition of SiO2 is required. In particular, TEOS-based PECVD enables approximately 85% conformal step coverage, and the ability to control the degree of step coverage by controlling the oxygen radicals within the plasma to vary deposition directionality.
The new TEOS delivery module offers a fully integrated, purpose-designed solution that is safe and easy to use: the TEOS source is easy to access and change, with an optional glovebox fitting onto the module for maximum safety, and the ability to connect the module into a cleanroom extraction system. The module may be either directly mounted onto the PlasmalabSystem100 or PlasmalabSystem133 process tool, or wall-mounted, and features optimised heated delivery lines to ensure efficient, high-uniformity SiO2 PECVD processes. Combined with Oxford Instruments’ high/low frequency plasma power mixing to control the stress of the deposited film and select between tensile, compressive and low-stress films, the new integrated TEOS system offers a powerful SiO2 deposition solution. Further details of the TEOS delivery module can be found at www.oxinst.co.uk/teos.
“The development of this enhanced TEOS solution is a significant addition to our range of deposition tools and processes, which now runs to PECVD, high-density/inductively coupled plasma (ICP) CVD for low-temperature deposition, and atomic layer deposition (ALD) for nanometre-controlled and 100% conformal processes,” said Ian McKinlay, Business Manager for Plasma Products at Oxford Instruments Plasma Technology. “These offer a strong complement to our plasma etching process tools.”
The company has already received its first order for a complete PlasmalabSystem133 TEOS system incorporating the new module from a prestigious Chinese institute.
Oxford Instruments is a leading provider of flexible process tools and leading-edge processes for the engineering of nano-scale structures and devices, based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition (ALD) and molecular beam epitaxy (MBE).