Epoxy MC; Glass Fibre Reinforced

Aug 20 2001

Advantages

Very low linear expansion, good tensile strength and flexural modulus compared to other epoxy moulding compounds. Generally better surface finish compared to cast components.

Disadvantages

Tendency to stick in mould. Mould shrinkage is greater than for mineral filled epoxy-moulding compounds.

Typical Properties

Property

Value

Density (g/cm3).

1.9

Surface Hardness

RM110

Tensile Strength (MPa)

68

Flexural Modulus (GPa)

14

Notched Izod (kJ/m)

0.02

Linear Expansion (/°C x 10-5)

2

Elongation at Break (%)

0.7

Strain at Yield (%)

N/A

Max. Operating Temp. (°C)

130

Water Absorption (%)

0.2

Oxygen Index (%)

28

Flammability UL94

V0

Volume Resistivity (log ohm.cm)

15

Dielectric Strength (MV/m)

15

Dissipation Factor1kHz

0.01

Dielectric Constant  1kHz

5

HDT @ 0.45 MPa (°C)

260+

HDT @ 1.80 MPa (°C)

200

Material Drying  hrs @ °C

NA

Melting Temp. Range (°C)

60 -  80

Mould Shrinkage (%)

0.5

Mould Temp. Range (°C)

160 - 190

Applications

Encapsulation of electronic and electrical services for electrical insulation, physical protection and protection against moisture.

 

Source : Abstracted from Plascams

For more information on Plascams please visit The Rubber and Plastics Research Association

 

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