Written by AZoMAug 20 2001
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Advantages |
| Lowest cost, lower mould shrinkage and higher elongation at break compared with other glass filled epoxy mouldings compounds. Generally better surface finish compared to cast epoxy components. |
Disadvantages |
| Tendency to stick in mould. Lowest tensile strength and flexural modulus compared with other epoxy moulding compounds. |
Typical Properties |
| | | Density (g/cm3). | 1.9 | | Surface Hardness | RM115 | | Tensile Strength (MPa) | 50 | | Flexural Modulus (GPa) | 10 | | Notched Izod (kJ/m) | 0.02 | | Linear Expansion (/°C x 10-5) | 2.5 | | Elongation at Break (%) | 1 | | Strain at Yield (%) | N/A | | Max. Operating Temp. (°C) | 130 | | Water Absorption (%) | 0.1 | | Oxygen Index (%) | 28 | | Flammability UL94 | V0 | | Volume Resistivity (log ohm.cm) | 15 | | Dielectric Strength (MV/m) | 15 | | Dissipation Factor1kHz | 0.1 | | Dielectric Constant 1kHz | 5 | | HDT @ 0.45 MPa (°C) | 260+ | | HDT @ 1.80 MPa (°C) | 200 | | Material Drying hrs @ °C | NA | | Melting Temp. Range (°C) | 60 - 80 | | Mould Shrinkage (%) | 0.3 | | Mould Temp. Range (°C) | 160 - 190 | |
Applications |
| Encapsulation of electronic and electronic devices for electrical insulation, physical protection and protection against moisture. |
| Source : Abstracted from Plascams For more information on Plascams please visit The Rubber and Plastics Research Association |