Written by AZoMAug 20 2001
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Advantages |
Lowest cost, lower mould shrinkage and higher elongation at break compared with other glass filled epoxy mouldings compounds. Generally better surface finish compared to cast epoxy components. |
Disadvantages |
Tendency to stick in mould. Lowest tensile strength and flexural modulus compared with other epoxy moulding compounds. |
Typical Properties |
| Density (g/cm3). | 1.9 | Surface Hardness | RM115 | Tensile Strength (MPa) | 50 | Flexural Modulus (GPa) | 10 | Notched Izod (kJ/m) | 0.02 | Linear Expansion (/°C x 10-5) | 2.5 | Elongation at Break (%) | 1 | Strain at Yield (%) | N/A | Max. Operating Temp. (°C) | 130 | Water Absorption (%) | 0.1 | Oxygen Index (%) | 28 | Flammability UL94 | V0 | Volume Resistivity (log ohm.cm) | 15 | Dielectric Strength (MV/m) | 15 | Dissipation Factor1kHz | 0.1 | Dielectric Constant 1kHz | 5 | HDT @ 0.45 MPa (°C) | 260+ | HDT @ 1.80 MPa (°C) | 200 | Material Drying hrs @ °C | NA | Melting Temp. Range (°C) | 60 - 80 | Mould Shrinkage (%) | 0.3 | Mould Temp. Range (°C) | 160 - 190 | |
Applications |
Encapsulation of electronic and electronic devices for electrical insulation, physical protection and protection against moisture. |
Source : Abstracted from Plascams For more information on Plascams please visit The Rubber and Plastics Research Association |