Epoxy MC; Mineral Filled

Aug 20 2001

Advantages

Lowest cost, lower mould shrinkage and higher elongation at break compared with other glass filled epoxy mouldings compounds. Generally better surface finish compared to cast epoxy components.

Disadvantages

Tendency to stick in mould. Lowest tensile strength and flexural modulus compared with other epoxy moulding compounds.

Typical Properties

Property

Value

Density (g/cm3).

1.9

Surface Hardness

RM115

Tensile Strength (MPa)

50

Flexural Modulus (GPa)

10

Notched Izod (kJ/m)

0.02

Linear Expansion (/°C x 10-5)

2.5

Elongation at Break (%)

1

Strain at Yield (%)

N/A

Max. Operating Temp. (°C)

130

Water Absorption (%)

0.1

Oxygen Index (%)

28

Flammability UL94

V0

Volume Resistivity (log ohm.cm)

15

Dielectric Strength (MV/m)

15

Dissipation Factor1kHz

0.1

Dielectric Constant  1kHz

5

HDT @ 0.45 MPa (°C)

260+

HDT @ 1.80 MPa (°C)

200

Material Drying  hrs @ °C

NA

Melting Temp. Range (°C)

60 -  80

Mould Shrinkage (%)

0.3

Mould Temp. Range (°C)

160 - 190

Applications

Encapsulation of electronic and electronic devices for electrical insulation, physical protection and protection against moisture.

 

Source : Abstracted from Plascams

For more information on Plascams please visit The Rubber and Plastics Research Association

 

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Related Books

  • Springer Handbook of Electronic and Photonic Materials

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