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Plasma Etch Chemistries for Deprocessing Integrated Circuits

Inductively Coupled Plasma Sources Provide Improved Etch Rates and Control

Inductively Coupled Plasma Sources Provide Improved Etch Rates and Control

Failure Analysis in Integrated Circuits - Anisotropic Dielectric Removal vs. Sequential Removal

Failure Analysis in Integrated Circuits - Anisotropic Dielectric Removal vs. Sequential Removal

Selective Reactive Ion Etching of P-Doped Polysilicon Using a Cl2/HBr Mixture

Selective Reactive Ion Etching of P-Doped Polysilicon Using a Cl2/HBr Mixture

Plasmas and the History of Plasma Reactors

Plasmas and the History of Plasma Reactors

Cadmium Sulfide – Properties, Applications and the Future for CdS

Cadmium Sulfide – Properties, Applications and the Future for CdS

Zinc Oxide – Properties, Applications and the Future for ZnO

Zinc Oxide – Properties, Applications and the Future for ZnO

Tellurium Dioxide (TeO2) – Properties and Applications

Antimony – Properties and Applications

Antimony – Properties and Applications

Tellurium – Properties and Applications

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