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BASF Develops Antistatic Thermoplastic Polyurethane Granulate

We are all familiar with the crackling sound and one’s hair standing on end when taking off a synthetic sweater – which is at worst mildly discomforting. In industry however, the electrostatic charging of plastics can cause the failure of electronic components and computer chips and is even capable of igniting combustible gases, vapours and dusts. On the surface of a polymer, which is at first electrically neutral, charge may be generated by contact with another surface and subsequent rapid separation. Without suitable dissipation, this charge can neutralise in an uncontrolled and abrupt fashion. To address this problem, BASF has now for the first time developed an antistatic thermoplastic polyurethane (TPU) granulate – at hand as of now under the Elastostat® brand name in the TPU portfolio.

From BASF Corporation 9 Jul 2013

Stradivari’s Workmanship Techniques Identified Using Analytical Methods

A new study, by Marco Malagodi from the Università degli Studi di Pavia in Italy and colleagues, uses a range of analytical methods to identify the techniques used by violin master Antonio Stradivari in the 17th cen...

From Springer - Science and Technology Publishers 8 Jul 2013

World’s Largest Nationwide Network Of EV Fast-Charging Stations To Be Built By ABB

ABB, the leading power and automation technology group, announced today that it has been selected by Fastned to supply chargers to more than 200 electric vehicle fast-charging stations in the Netherlands, bringing an EV ...

From ABB Measurement and Analytics Analytical Products 8 Jul 2013

H.C. Starck Tantalum Supply Chain Receives Third EICC Certificate

H.C. Starck, a leading manufacturer of technology metals and advanced ceramics, announced today that its tantalum supply chain has been declared free of “conflict minerals” for a third consecutive year follow...

From HC Starck Tungsten GmbH 8 Jul 2013

Toshiba America Electronic Components Moves to New Larger Campus in Irvine

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced it has moved its corporate headquarters to 9740 Irvine Blvd., in Irvine, California.

8 Jul 2013

Advantest Offers New T5831 System for Testing Next-Generation ICs Used for Mobile Applications

Leading semiconductor test equipment supplier Advantest Corporation's new T5831 system for testing next-generation ICs used in mobile applications, including NAND Flash with high-speed ONFi or Toggle Mode interfaces as well as managed NAND devices such as embedded multi-media cards (eMMC), is now being delivered to customers.

8 Jul 2013

Antarctic Research Project Selects Mantracourt’s ICA4S Load Cell Amplifiers

Mantracourt Electronics’ miniature load cell and strain gauge amplifier (ICA4S) was chosen as a key component in a project to build a drill that recently extracted a 763m ice core from the Ross Ice Shelf in western Antarctica. The research from the study will build a better picture of atmospheric greenhouse gases, sea level and temperature change over the last 20,000-40,000 years.

8 Jul 2013

Advantest Offers Mobile PMIC Solution for Testing PMICs and Other SoC Semiconductors

Leading semiconductor test equipment supplier Advantest Corporation has entered the market for testing system-on-chip (SoC) mobile power-management ICs (PMIC) by delivering the semiconductor industry's most cost-compelling solution using the V93000 platform.

8 Jul 2013

New Report on Packaging Innovations in Non-Alcoholic Drinks

Research and Markets has announced the addition of the "Magic Packaging in Drinks, Water, and Juice" report to their offering.

From Research and Markets 8 Jul 2013

Physicists Discover Boron Arsenide as Excellent Thermal Conductor on Par with Diamonde

An unlikely material, cubic boron arsenide, could deliver an extraordinarily high thermal conductivity – on par with the industry standard set by costly diamond – researchers report in the current issue of th...

8 Jul 2013

USHIO to Deliver Large-Field Interposer Stepper to Advanced Packaging Manufacturer by July End

USHIO INC. today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.

8 Jul 2013

BASF to Expand its Plastics Additives Business Over Next Five Years

As resources are becoming scarcer, lightweight and stable plastics will continue to gain in importance, replacing less sustainable materials in industries as diverse as automotive, building & construction, agriculture or electronics.

From BASF Corporation 8 Jul 2013

Research and Markets Adds New Report on Metal Stamping Industry in the US

Research and Markets has announced the addition of the "Metal Stamping Industry in the US 2012-2016" report to their offering.

From Research and Markets 8 Jul 2013

BASF Argentina Coatings Receives Gold Award from Ford Motor Company

Ford Motor Company hosted its 15th annual World Excellence Awards (WEA) at the end of May and BASF Argentina Coatings was honored with a Gold award which is awarded to the top 5 percent of qualifying suppliers who demonstrate superior quality, delivery and cost performance.

From BASF Corporation 8 Jul 2013