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Vicor to Unveil ChiP Power Component Packaging Technology at PCIM 2013

Vicor Corporation today announced its participation in the Power Conversion Intelligent Motion (PCIM) 2013 conference, the international conference devoted to power electronics and its applications, hosted in Nuremberg, Germany, May 14-16, 2013.

8 May 2013

Study Challenges All Classic Theories of Glass Transition Behavior

Fact or fiction? Stained glass found in medieval cathedrals becomes thicker at the bottom because glass moves over time. For years researchers have had their doubts, now a team at Texas Tech University has further evidence that the glass is not going anywhere.

8 May 2013

PCD&F Honors Dow’s MICROFILL THF-100 Electrolytic Copper with NPI Award

Dow Electronic Materials, a business unit of The Dow Chemical Company, announced today that its MICROFILL™ THF-100 Electrolytic Copper received the New Product Introduction (NPI) Award from Printed Circuit Design and Fab Magazine (PCD&F) in the plating category.

From Dow Electronics 8 May 2013

Meller Optics Introduces High Wear and Chemical Resistant Sapphire and Ruby Balls

Meller Optics, Inc. has introduced a full line of sapphire and ruby balls that come in 42 precise small sizes and can withstand high wear and chemical resistance, and thermal and environmental shock.

8 May 2013

1366 Technologies and Tokuyama Partner to Reduce Cost of Photovoltaics

Today, solar wafer manufacturer 1366 Technologies and Tokuyama Corporation (4043:JP), the leading silicon producer in Japan and the fourth largest producer of silicon in the world, entered into a strategic partnership designed to drive down the cost of photovoltaics.

8 May 2013

Nordson MARCH Receives EM Asia-China Award for Self-Contained Vacuum Plasma System

Nordson MARCH, a Nordson Company, a global leader in plasma processing technology, received the EM Asia-China Award for its FlexVIA™ Plasma System, a completely self-contained vacuum plasma system designed for maximum efficiency and cost-effective etch, desmear, and surface activation treatment of flexible printed circuit boards (PCBs).

8 May 2013

Japrotek Selects Outokumpu Stainless Steel for Storage Tanks

Outokumpu delivers 150 tons of stainless steel sheet to construction of storage tanks by Japrotek. Japrotek is a Finnish-based company that produces agitators, pressure vessels and large tanks, built on site, for the process industries.

From Outokumpu Stainless, Inc. 8 May 2013

Oxford Instruments Plasma Technology Plan to Restructure to Sharpen the Company's Main Focus

Oxford Instruments Plasma Technology, a leading provider of plasma etch and deposition systems, has announced a restructuring that will sharpen the focus on its main target customer groups, and build on the Company’s existing strengths in its markets.

From Oxford Instruments Semiconductor 7 May 2013

Cytec to Exhibit a Range of Advanced Composite and Process Material at All-Energy 2013 Conference

Cytec will be exhibiting its range of advanced composite and process materials on stand number D51 at All-Energy 2013, which is being held in the Aberdeen Exhibition & Conference Centre, Bridge of Don, Aberdeen on the 22 and 23 May.

7 May 2013

New DS Series Double Station Blow Moulding Machine by Smart Machineries and Moulds Pvt. Ltd

Smart Machineries and Moulds Pvt. Ltd. have come up with the new DS Series Double Station Blow Moulding Machine. The DS Series blow moulding machine has 5 main variants based on the capacity of bottles/cans like 250 ml, 500 ml, 1 Liter, 2 Liters and 5 Liters.

7 May 2013

HORIBA Scientific Announce Development of a Process for Faster Sputtering of Polymers

The latest GDOES advancement from HORIBA allows for rapid polymer sputtering, delivering precise elemental composition depth profiles with improved sensitivity.

From HORIBA 7 May 2013

Recent Changes in Printed Technologies

Variously called Printed, Flexible or Organic Electronics, it is one of the fastest growing technologies in the world. It is of vital interest to industries as diverse as consumer goods, healthcare, mobility, electro...

From IDTechEx 7 May 2013

Tile of Spain Sponsors COVERINGS 2013 Stone and Tile Show

This year marks 26 years of Spanish innovation at COVERINGS, The Ultimate Stone and Tile Experience. Tile of Spain, the international brand representing 125 ceramic tile manufacturers belonging to the Spanish Ceramic Tile Manufacturers' Association (ASCER), once again served as a show sponsor.

7 May 2013

New, Low-Power, High-Performance Microarchitecture from Intel

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.

7 May 2013

New Line of Screwdriving Bits and Bit Holders Engineered Specifically for Impact Tools

As professional tradesmen continually seek power tool accessories that stand up on the toughest jobsites and help them do their jobs better, faster, or easier, IRWIN Tools announces the introduction of the Impact Performance Series™ line of screwdriving bits, nutsetters, socket adapters, and bit holders.

7 May 2013

Materials Science News

Vicor to Unveil ChiP Power Component Packaging Technology at PCIM 2013

Study Challenges All Classic Theories of Glass Transition Behavior

PCD&F Honors Dow’s MICROFILL THF-100 Electrolytic Copper with NPI Award

Meller Optics Introduces High Wear and Chemical Resistant Sapphire and Ruby Balls

1366 Technologies and Tokuyama Partner to Reduce Cost of Photovoltaics

Nordson MARCH Receives EM Asia-China Award for Self-Contained Vacuum Plasma System

Japrotek Selects Outokumpu Stainless Steel for Storage Tanks

Oxford Instruments Plasma Technology Plan to Restructure to Sharpen the Company's Main Focus

Cytec to Exhibit a Range of Advanced Composite and Process Material at All-Energy 2013 Conference

New DS Series Double Station Blow Moulding Machine by Smart Machineries and Moulds Pvt. Ltd

HORIBA Scientific Announce Development of a Process for Faster Sputtering of Polymers

Recent Changes in Printed Technologies

Tile of Spain Sponsors COVERINGS 2013 Stone and Tile Show

New, Low-Power, High-Performance Microarchitecture from Intel

New Line of Screwdriving Bits and Bit Holders Engineered Specifically for Impact Tools

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