Bre Pettis, CEO of MakerBot, and the global leader in the desktop 3D printing industry, was the featured guest speaker at this week’s meeting of the National Additive Manufacturing Innovation Institute, formerly known as NAMII, and now known as America Makes, held October 8, 2013, in Youngstown, Ohio.
Indium Corporation introduces a new,high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0)materialis especially suited for assembly processesin which the components don’t allow for proper outgassing of volatized flux.
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.
The Siemens Industry Automation Division has equipped the Simit simulation framework for the virtual commissioning of Simatic-based automation solutions with new functions in version 7.1. The Simit Contec library was added to the pre-assembled software components and models.
At this year's SPS IPC Drives automation trade fair, Siemens will be supplying answers to the current and future challenges facing manufacturing industry under its trade fair banner "Making Things Right". "Our aim this year is to illustrate to visitors how to improve their production – from design, through engineering and operation to maintenance", explains Heinz Eisenbeiss, Director of the Siemens booth at this year's show.
Printed circuit boards for consumer electronics are like a city skyline. With limited real estate to build across a neighborhood block, developers build up, story-upon-story. Memory chips and logic devices are being stacked in a similar fashion on circuit boards the size of credit cards as a way to increase power and performance across the board’s “real estate.”
The Wayne State University College of Engineering will host lab tours as part of the American Society of Mechanical Engineers (ASME) 2013 Internal Combustion Engine Fall Technical Conference, set for Oct. 13-16 in Dearborn. The tours will be held for conference participants starting at 8:40 a.m. on Wednesday, Oct. 16.
Oerlikon Leybold Vacuum received a double-digit million Euro order for vacuum technology from a global manufacturer of uranium centrifuges for nuclear power facilities. Oerlikon Leybold’s vacuum solutions will play an essential role in a nuclear plant presently under construction in the United States.
Continuing their informative and educational series of global plasma seminars and workshops, Oxford Instruments Plasma Technology, together with UC Santa Barbara, CA, USA will hold a technical workshop addressing latest developments in ALD and Ion Beam etch and deposition on 12th November 2013.
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