INM – Leibniz Institute for New Materials will present new nanoparticle inks, created using transparent, conductive oxides (TCOs), at the 2016 International Nanotechnology Exhibition and Conference (Nano Tech) in Tokyo, Japan. The nanoparticle inks are capable of providing cost-efficient, patterned, conductive, and transparent coatings for flexible touchscreens.
Cornell engineering professor Huili (Grace) Xing and her research team aim to be successful in making smaller switches perform large jobs in a more efficient way than currently possible.
Researchers at the Massachusetts Institute of Technology (MIT) have produced a thin-film material whose electrical and phase characteristics can be altered between two crystal states - one semiconducting and one metallic - by applying an electrical charge.
RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has introduced the latest range of E-Blocks electronic modules and the supporting Flowcode 6 development environment from Matrix Technology Solutions.
Stanford University researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductor technologies, have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.
The Centre for Process Innovation (CPI) has recently partnered with NovaCentrix to install a specialist system designed for the high speed photonic curing of printed electronics inks. The NovaCentrix PulseForge 1300 state-of-the-art system is the first of its kind in the UK to be available to clients on an open access basis and will aid the commercialisation of a host of applications including printed sensing and Radio Frequency Identification (RFID) and Near Field Communication (NFC) antennas for smart packaging. The recent installation builds upon CPI’s existing capability for the market adoption of printed sensing technologies, allowing companies to develop and scale up their concepts from laboratory scale right through to pilot production.
At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm. The new channel material improves transconductance (gm) and read current which is crucial to enable further VNAND cost reduction by adding additional layers in 3D vertical architecture.
A futuristic band-aid has been developed that is sticky and stretchable whilst allowing electronics to be integrated into it. The band-aid consists of a hydrogel and can have LEDs and temperature sensors embedded into its structure. Microscale drug reservoirs and delivery channels can also be integrated into the band-aid which will allow the delivery of drugs in response to changes in body temperature or other biological signals such as blood glucose levels.
MKM Mansfelder Kupfer- und Messing GmbH (MKM), Hettstedt, has begun the production of high-purity, oxygen-free copper strip (Cu-OFE). MKM is the only manufacturer in the world with the ability to produce this oxygen-free, hot-rolled copper strip in a continuous production process: our innovative Conti-M® cast-rolling technology makes it possible to cast, hot-roll, mill and coil copper strip in an uninterrupted process.
CEA-Leti, coordinator of the pan-European consortium EuroCPS, today announced that the 15 partners are continuing their support for SMEs, midcaps and large companies with the second open call for industrial projects, which is open from Oct. 28 to Dec. 2. Innovative cyber-physical system (CPS) projects can be submitted.
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