Cascade Microtech, Inc., a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced that the Company has been named winner of the American Technology Award (ATA) in the category of Semiconductors & Electronic Components for its APS200TESLA power electronics wafer probe solution.
3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates.
Today ARM announced the establishment of a new CPU Design Center in the Hsinchu Science Park, Hsinchu, Taiwan. This is ARM’s first CPU Design Center in Asia, and it will focus on the design, verification and delivery of the ARM® Cortex®-M processor series targeted at the Internet of Things (IoT), wearables and embedded applications markets.
Research and Markets has announced the addition of the "Analysis of the Global LED Materials Market" report to their offering.
Indium Corporation’s Assistant Technical Manager Liyakathali Koorithodi will present at the SMTA India chapter’s quarterly meeting on May 30 at Sathyam Group Resorts in Sriperumbudur, India.
Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, recently signed a global distribution agreement with Akros Silicon, a provider of leading-edge power management ICs. Akros’ solutions help manufacturers of electronic equipment create more efficient and advanced products at reduced costs, while enabling end users the ability to reduce energy usage.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a new integrated solution to significantly cut down die-package interconnect planning time from weeks to days by reducing iterations between silicon and package design teams.
Optomec announced today that the company will feature Aerosol Jet printers for 3D Printed Electronics applications at the LOPEC International Conference and Exhibition. The conference will be held May 26-28 at the Messe Munchen in Germany. Aerosol Jet Systems will be showcased in Hall B0, stand # 311.
Dr Sara Ronca, the principal investigator for the research into the plastic, said: “The current plastic cases do not dissipate heat and have been known to get too hot, with phones doing strange things.
Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the company will showcase its line of high quality optical products for use in defense and aerospace, instrumentation and analytical processing, sensors and detectors, semiconductor process equipment, and medical and laser applications at Optatec, the international trade fair for optical technologies, components and systems, in Frankfurt Germany May 20-22, 2014 at Frankfurt Exhibition Centre in Hall 3, Stand H37.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.