IBM today unveiled a strategic initiative to drive Flash technology further into the enterprise to help organizations better tackle the mounting challenges of Big Data.
It sounds futuristic, but today Carnegie Mellon University researchers are developing edible electronic devices that can be implanted in the body to improve patient care.
Thermal Engineering Associates, Inc. (TEA) announces that it is now accepting wafer orders for its new 1mm square Thermal Test Chip (TTC-1001). This new chip has many of the same advantages as the popular TEA TTC-1002 (2.5mm square) TTC. The TTC-1001 may be arrayed in many ways to create square or rectangular devices in increments of 1mm.
Plessey announced that samples of its Gallium Nitride (GaN) on silicon LED products (p/n PLW111010) are available today. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
Vishay Intertechnology, Inc. today introduced a new high-performance metallized polypropylene film snubber capacitor. Configurable for direct mounting on insulated gate bipolar transistor (IGBT) modules, the Vishay Roederstein MKP386M features a wide capacitance range from 0.047 to 10 microfarads, high-temperature operation to + 105 °C, and seven voltage ratings from 700 VDC to 2500 VDC and 420 VAC to 800 VAC.
Momentive Performance Materials Inc. (MPM) announces today an expansion of its current technology center in Seoul, Korea, creating a global innovation center focused on the electronics industry.
Optomec announced today that the Company’s Intellectual Property (IP) portfolio in the field of Additive Manufacturing grew to 35 patents with the addition of six new patents granted in 2012. These new patents cover inventions for the Company’s Aerosol Jet technology used for Printed Electronics. Optomec also announced it has received notices of allowance for additional patents which are expected to be granted in 2013.
Taiwan's Green Trade Project Office is bringing a delegation of exhibitors to participate in the 2013 FIEE trade show in Sao Paulo, Brazil, aiming to help Taiwan's electronics manufacturers seize the great opportunity for business in the run-up to the 2014 FIFA World Cup and 2016 Rio Olympics.
Reportlinker.com announces that a new market research report is available in its catalogue: Global Printed Electronics Market—Analyzing the True Potential
The China Information Technology Expo (CITE), co-hosted by the Ministry of Industry and Information Technology of PRC (MIIT) and Shenzhen Municipal Government, and produced by China Electronic Appliance Corporation and Shenzhen Flat Panel Display Industry Association, will be held from April 10 to 12, 2013 at the Shenzhen Convention & Exhibition Center.
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