A research team at Massachusetts Institute of Technology (MIT) headed by Martin Zwierlein is carrying out experiments to study high temperature superconductors and superconductivity of electrons in metals since they have the potential to greatly impact the energy efficiency.
Dow Corning which specialises in silicones and silicone based technology will display silicone-based materials at the exhibition titled “Strategies in Light” which is to be held at the Santa Clara Convention Centre during February 7-9, 2012.
Ioxus, a company specializing in high-performance ultracapacitor technology, has introduced its 3,000-F ultracapacitor called iCAP. It is the first size in a new portfolio of cell products.
US based IEE has introduced its 3D Display technology to retail applications such as kiosks, point of sale displays and pole displays.
Researchers at the University of Twente’s MESA+ Institute for Nanotechnology have created an optical amplifier doped with a rare earth ion.
A team of researchers from the University of Dallas are in the process of establishing that a new material could cool electronic devices such as computers and cell phones in an effective manner thus increasing their performance and life.
Online research company, Market Research.com has announced that it has released a new report titled “Active Electronic Components: Technologies and Global Markets—Focus on North America”.
Corning has declared its plans to participate in the International Consumer Electronics Show (CES) to be held in Las Vegas. The company will demonstrate the role of highly engineered specialty glass in meeting current trends, including robust large-format design aesthetics, touch technology, enhanced functionality from smaller form factors and connected devices in latest application spaces.
STATS ChipPAC, a provider of semiconductor advanced packaging and test solutions, has conducted the groundbreaking ceremony for its new plant to be built close to its existing facility in Yishun, Singapore, to expand its production capabilities for sophisticated wafer level technologies such as through silicon via (TSV), integrated passive devices (IPD), wafer level chip scale packaging (WLCSP) and embedded wafer level ball grid array (eWLB).
ATC is a pioneer in producing millimeter-wave, microwave, and RF passive components. An ultra-broadband capacitor (UBC) has been developed for optical high-speed data communications signal integrity markets by ATC.
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