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New Highly Conductive Epoxy Designed for Tightly Packed Electronic Circuits

New Highly Conductive Epoxy Designed for Tightly Packed Electronic Circuits

Worldwide Industrial Launches Plastic and Metal Enclosures Manufacturers Directory

Dow Electronic Materials Starts Construction of New Eastern China Manufacturing Facility

Dow Electronic Materials Starts Construction of New Eastern China Manufacturing Facility

Shrink Nanotechnologies Enters Multi-Year Exclusive License for Electronic Glue Chemistry

Shrink Nanotechnologies Enters Multi-Year Exclusive License for Electronic Glue Chemistry

Shocking Technologies Opens World's First Facility for Voltage Switchable Dielectric Material

Unidym and Samsung Sign License Agreement to Develop Carbon-Based Electronics

Unidym and Samsung Sign License Agreement to Develop Carbon-Based Electronics

Innovative Micro Technology Adds Through-Silicon Via to Its Product Inventory

Peregrine Semiconductor, Soitec to Produce New Bonded SOS Wafer for UltraCMOS Processing

Peregrine Semiconductor, Soitec to Produce New Bonded SOS Wafer for UltraCMOS Processing

Nanosys and SEMATECH Collaborate to Develop Advanced Material Technology

Nanosys and SEMATECH Collaborate to Develop Advanced Material Technology

Carbon Nanotubes May Become Building Blocks of Microelectronic Devices

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