E-beam supplier Vistec, along with semiconductor research group CEA/Leti, and emerging design and software company D2S, today announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB)...
A joint team of researchers at CIC nanoGUNE (San Sebastian, Spain) and the
Max
Planck Institutes of Biochemistry and Plasma Physics (Munich, Germany) report
the non-invasive and nanoscale resolved infrared mapping of strain fields in
semiconductors.
An international team of scientists, among them researchers from the department of Theoretical Condensed Matter Physics of the Universidad Autónoma de Madrid (UAM), present a new method to manipulate atoms.
Nanot...
Using a simple chemical process, scientists at Cornell
and DuPont have invented a method of preparing carbon nanotubes for suspension
in a semiconducting "ink," which can then be printed into such thin,
flexible electronics as transistors and photovoltaic materials.
Scientists at DuPont
and Cornell University in Ithaca, N.Y., have used a simple chemical process
to convert mixtures of metallic and semiconducting carbon nanotubes into solely
semiconducting carbon nanotubes with electrical characteristics well-suited
for plastic electronics.
As part of its continuing success in the rapidly growing solar sector, BOC
Lien Hwa (BOCLH), Taiwan’s leading electronic gases supplier, has been
selected to supply Auria Solar in Tainan, with a wide range of bulk & specialty
gases used in the manufacturing process of solar cells.
For those who love “green” compact fluorescent bulbs but hate their cold light, here’s some good news: Researchers are closer to flipping the switch on cheaper, richer LED-type room lighting.
Univers...
3M and EV Group (EVG) have
agreed to settle the patent infringement litigation brought by EVG against 3M
in the U.S. District Court for the Southern District of New York relating to
systems for temporary wafer bonding.
Researchers at the National
Institute of Standards and Technology (NIST) have developed a method to
measure the toughness—the resistance to fracture—of the thin insulating
films that play a critical role in high-performance integrated circuits. The
new technique could help improve the reliability and manufacturability of ICs
and, better yet, it’s one that state-of-the-art microelectronics manufacturers
can use with equipment they already own.
Nanoscience researchers at Lund University in Sweden have shown that they can control the growth and crystal structure of nanowires down to the single atom level.
How this can be done is described in an article to ap...
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