May 12 2010
Nanoplas, a leading global supplier of HDRF Plasma Processing Equipment for MEMS, 3D Semiconductors and III-V compounds, today announced that it has installed multiple tools in the two MEMS manufacturing sites of Tronics, a global leading manufacturer of integrated custom MEMS components, located in Grenoble, France and Dallas, Texas, U.S.A.
"We were looking for a reliable partner who could bring us innovative and cost saving process technologies," said Brian Stephenson, COO of the Texas based US manufacturing operation of Tronics. "Nanoplas HDRF Technology allows us to skip several expensive process steps as well as offering a flexible platform for development of future advanced processes for MEMS manufacturing, including packaging." Photo Resist stripping, Bosch polymer removal, surface activation, sacrificial polymer release and organic material removal can all be done on the same tool. "We were impressed by the versatility of this Technology. Installing these tools at both of our facilities is also in line with our committed goal of offering our customers leading edge, dual source MEMS manufacturing capability." added Stephenson.
"We are very pleased that a MEMS manufacturing leader such as Tronics has made the choice for our innovative Technology." said Peter Dijkstra, Vice President Global Sales at Nanoplas. "We are very satisfied for the confirmed success of our new product line. The tool of choice, our new DSB 6000, is a production tool which is easy to use, easy to maintain and very powerful for different applications.
HDRF is an innovative approach for dry processing
The Nanoplas HDRF patented technology produces a high-density flux of radicals. Isotropic in nature, HDRF processing allows isotropic chemical processing in a controlled manner that is unrivaled in the industry. It offers Damage-Free processing and targets the growing demand for low temperature processing.
Because of the high radical density downstream plasma and low temperature capabilities, the Nanoplas HDRF technology is ideal for the following applications:
- Bosch Polymer Removal
- Dry release of organic materials
- Photo resist stripping from 70degC to 250degC
- Residue removal Surface activation prior to wafer bonding