PFC Flexible Circuits Limited announced today that it has tested and approved the new high speed DuPont Pyralux TK flexible circuit material. DuPont introduced Pyralux TK at the IPC APEX Conference & Exhibition in April.
PFC was chosen by DuPont as a beta site to process Pyralux TK in January 2010 as well as to provide preliminary testing and feedback. Pyralux TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont Teflon fluoropolymer film and Kapton polyimide film for high speed digital and high frequency flexible circuit applications. DuPont Pyralux TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
"PFC specializes in high speed, impedance control constructions and the dielectric constants (DK) and loss requirements are getting tougher and tougher to meet", said Steve Kelly, President of PFC. We needed a dielectric material that could hold tight thickness tolerances to achieve signal speeds and impedance characteristics our customers have requested. We ran Pyralux TK through our process and have concluded that it provides the construction and electrical characteristics that our customers require," said Kelly. We are now quoting customers and have provided prototypes using Pyralux TK. "
"Pyralux TK is a breakthrough for high speed applications," said Thomas D. Lantzer -- market segment leader, High Reliability & Telecom, DuPont Circuit & Packaging Materials. We knew PFC was providing high speed, impedance controlled circuits and thought they would be a good fit for testing the material. The results have been extremely positive."