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IMT Introduces Hermetic Au-Au Thermo Compression Bonding for Wafer Level Packaging

A specialist in the development and execution of wafer level packaging, Innovative Micro Technology (IMT) has launched its hermetic Au-Au thermo compression bonding, which is marked as the industry’s highly economical hermetic wafer level package (WLP) bond.

The bond took about a year to develop. The company’s most important product is its patented low-temperature hermetic eutectic bond. The new bond endorses reflow temperatures of over 500°C and features sealing temperatures of less than 190°C, making it suitable for temperature-sensitive electronics or sensors that demand a hermetic package. The width of the bond line can be limited at below 50 µ, resulting in optimal spacing for application functionality, while lowering the production costs and maintaining the package to a compact size.

Yole Développement’s Eric Mounier commented that packaging is currently the vital component required to obtain the level of integration as well as to meet the specifications and volumes demanded by customers. New methods in low-temperature wafer bonding could alter the existing production methods of MEMS, he added.

The Chairman and Chief Executive Officer of IMT, John Foster, stated that the company included the WLP in its first manufacturing product in 2002 and now it is being used in over 80% of its total business.

Source: http://www.imtmems.com

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