Silicon Genesis (SiGen), a provider of engineered substrate process technology for the solar, optoelectronics, display and semiconductor markets, announced that it will present its kerf-free wafering technology for high-volume and high-efficiency monocrystalline silicon (c-Si) cell production at 2011 European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC).
The company will also detail the cost benefits of the technology in a visual presentation titled, “Mono and Multi Crystalline Silicon – Supply Chain Analysis and BOS Impact”. Kerf is a material that is changed into saw dust during the sawing processes.
SiGen has also made an announcement that it is continuing to grow with its PolyMax high volume manufacturing system. The company has manufactured 156 mm square kerf-free c-Si wafers in various thicknesses ranging from 80 to 125 um. The system offers the first true mono c-Si kerf-free wafering for the photovoltaic (PV) industry.
The PolyMax system helps to substitute wire saw processes with an inexpensive waste-free wafering technology. The technology has an ability to produce wafers thinner than those produced with wire saw process. This enables the PV industry to produce cells with lower cost and very high conversion efficiencies. CEO of the company, Francois Henley stated that the increased availability of the kerf-free wafering technology helps the industry to beneficially reach the unsubsidized grid parity.