FSI International, a provider of surface conditioning devices for the production of microelectronics, has declared that two major semiconductor manufacturers have placed follow-on orders for FSI International’s ORION single wafer cleaning systems.
FSI International supplies an extensive line of cleaning products such as single- and batch-wafer systems for cryogenic, spray and immersion aerosol technologies. These platforms allow the company’s customers to accomplish their productivity targets and obtain performance flexibility.
FSI International plans to deliver the ORION single wafer cleaning systems in the fiscal year 2012. One company will utilize the system for front-end-of-line (FEOL) all-wet photoresist removal applications based on the company’s high-temperature ViPR process technology, while the other company will utilize the system for back-end-of-line (BEOL) applications.
According to major producers of integrated circuits, when the ORION single wafer cleaning system is utilized for FEOL applications, its novel closed chamber design allows the utilization of high-temperature ViPR process for all-wet stripping of highly embedded photoresist.
FSI International’s unique ViPR technology minimizes defects, reduces material loss, and offers cost of ownership benefits. Other major equipment producers are finding that the ORION system’s closed chamber technology removes ash by-products and etch effectively, while eliminating galvanic corrosion and retaining the properties of dielectric and metal films. The design of the process chamber featuring a built-in spray bar improves particle stripping, minimizes chemical consumption, reduces process time and enhances uniformity.