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Dow Corning to Launch Silicone-Based Solutions at CHINACOAT 2012 Chengdu Conference

Dow Corning has announced that the company will exhibit its effective silicone-based solutions at the CHINACOAT 2012 Chengdu Conference. This program will be held from 7 to 8 June, 2012. These silicone-based solutions can be used in solvent-based and waterborne coatings, inks and paints.

The company’s China Coatings Technical Specialist, Robin Shen will launch its family of slip and leveling additives during the conference. These additives are formulated specifically for use in radiation-cured and solvent-borne coatings, inks and paints. The applications also include many products enabling the tailored leveling and flow solution design to be applied on furniture, plastic and wood substrates.

The company offers multipurpose additives such as Dow Corning 204SL additive, Dow Corning 205SL additive and Dow Corning 401LS, which offer various solubilities and additional features at low addition levels. Formulators can use these multi-use additives in order to specifically expand the tailored solutions for getting optimized performance, when used in several resin applications and systems.

Dow Corning 205SL additive functions as antifoam and excellent hand feel is offered. Dow Corning 204SL additive gives excellent slip performance when used in radiation curable coatings and enables flexibility in formulation and low VOC levels. Dow Corning 401LS additive provides enhanced slip performance and leveling and good wetting properties, wherein coating clarity is not affected in solvent-borne formulations.

Source: http://www.dowcorning.com/

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