Aug 18 2005
Hitachi Chemical Company will increase the production capacity of die bonding films by 50 percent in phases by September 2006. Demand for the films, which are used in producing stacked multi-chip packages (stacked MCPs) for flash memory and the like, is expected to increase greatly.
To meet the increasing needs for more compact electronic devices as digital cameras, and for devices with greater functionality as camera phones, semiconductor devices are now required to provide faster logic processing speeds and larger memory capacities. In this respect, the industry’s demand for stacked MCPs is sharply increasing, since they allow higher mounting densities, and a subsequent reduction in the mounting area.
Stacked MCP is a package with multiple layers of thin semiconductor chips. In addition to conventionally prevalent two or three stacked MCPs, greater layer of four or five stacked MCPs are being developed. Along with this, the demand for die bonding films is also growing sharply, because they can be attached over the wafer back surfaces directly after the backgrinding process and allow post-dicing mounting easily.
Hitachi Chemical will invest approximately one billion yen to expand the production line in phases at its Goi Works (Ichihara-shi, Chiba) for completion by September 2006. The investment will increase the present production capacity by approximately 50 percent, to approximately 1.2 million square meters of film production per year.
Hitachi Chemical has secured approximately 500 patents (including those pending) at home and abroad covering wide areas of film physical properties, materials and packages, which are all considered indispensable for the die bonding films to maintain the aforementioned reliability in the die bonding film area. The company intends to further enhance customer satisfaction and strengthen its business by improving its technology and strengthening intellectual property.
http://www.hitachi-chem.co.jp/