Sep 6 2013
Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Surface Mount Technology Association International (SMTAi) October 15-17 in Fort Worth, Texas.
SACM™ is a high-reliability solder alloy that offers drop-shock test performance far superior to other SAC alloys, without compromising on thermal cycling. Its low silver content makes it a cost-effective solution for portable electronics.
The platform consists of Indium8.9 Series solder pastes using Indium Corporation’s patent-pending SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls (spheres) for package-level interconnect.
Dr. Ning-Cheng Lee, Vice President of Technology, said, SACM™ offers a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions.
“We see a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions,” Dr. Lee said. “These micro-structural improvements translate into an 8X (800%) improvement in drop-shock performance and 50% extension in thermal cycling.”
SACM™ is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength. The reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
Indium Corporation will be exhibiting at booth 318.
For more information about Indium Corporation’s SACM™ solder paste, visit www.indium.com/SACM