LEAF International 2013: Dow Corning to Highlight Architectural Insulation Module Technology

Dow Corning Corporation – a global leader in the development of silicon-based innovation for the high-performance building industry – will showcase its Dow Corning® Architectural Insulation Module (AIM) technology at LEAF International 2013, scheduled for October 16-18 at the Hotel Palace Berlin in Berlin, Germany.

Key advantages of the innovative solution for next-generation curtainwalls will be highlighted in both a session presentation and a technology display.

Dr.-Ing. Karl Stefan Dewald, Europe region business development specialist for Dow Corning High Performance Building Solutions, will present "Designing Innovative Façades Using High Performance Insulation" from 13:15 to 13:45 on Thursday, October 17. Dewald will detail how Dow Corning Architectural Insulation Modules, featuring high-performance Dow Corning® Vacuum Insulation Panel (VIP), provide a design-enabling insulation solution that combines the aesthetics and convenience of curtainwall construction with energy-savings benefits. He will discuss the excellent thermal performance of the thin-profile Dow Corning AIM technology, which can help maximize usable building floor space in slim wall constructions with high R-value insulation.

Throughout the LEAF event, Dow Corning High Performance Building Solutions also will maintain a technology display at Stand 2 in the exhibition area. Featured technologies include Dow Corning Architectural Insulation Modules, crystal-clear bonding solutions and high-performance structural glazing solutions. Event delegates are invited to arrange one-on-one business meetings.

To learn more about Dow Corning Architectural Insulation Modules, visit dowcorning.com/HPInsulation. Information about Dow Corning's full range of silicon-based materials for high-performance building solutions is available at dowcorning.com/construction.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Dow Corning. (2019, February 09). LEAF International 2013: Dow Corning to Highlight Architectural Insulation Module Technology. AZoM. Retrieved on July 17, 2024 from https://www.azom.com/news.aspx?newsID=38535.

  • MLA

    Dow Corning. "LEAF International 2013: Dow Corning to Highlight Architectural Insulation Module Technology". AZoM. 17 July 2024. <https://www.azom.com/news.aspx?newsID=38535>.

  • Chicago

    Dow Corning. "LEAF International 2013: Dow Corning to Highlight Architectural Insulation Module Technology". AZoM. https://www.azom.com/news.aspx?newsID=38535. (accessed July 17, 2024).

  • Harvard

    Dow Corning. 2019. LEAF International 2013: Dow Corning to Highlight Architectural Insulation Module Technology. AZoM, viewed 17 July 2024, https://www.azom.com/news.aspx?newsID=38535.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.