LEAF International 2013: Dow Corning to Highlight Architectural Insulation Module Technology

Dow Corning Corporation – a global leader in the development of silicon-based innovation for the high-performance building industry – will showcase its Dow Corning® Architectural Insulation Module (AIM) technology at LEAF International 2013, scheduled for October 16-18 at the Hotel Palace Berlin in Berlin, Germany.

Key advantages of the innovative solution for next-generation curtainwalls will be highlighted in both a session presentation and a technology display.

Dr.-Ing. Karl Stefan Dewald, Europe region business development specialist for Dow Corning High Performance Building Solutions, will present "Designing Innovative Façades Using High Performance Insulation" from 13:15 to 13:45 on Thursday, October 17. Dewald will detail how Dow Corning Architectural Insulation Modules, featuring high-performance Dow Corning® Vacuum Insulation Panel (VIP), provide a design-enabling insulation solution that combines the aesthetics and convenience of curtainwall construction with energy-savings benefits. He will discuss the excellent thermal performance of the thin-profile Dow Corning AIM technology, which can help maximize usable building floor space in slim wall constructions with high R-value insulation.

Throughout the LEAF event, Dow Corning High Performance Building Solutions also will maintain a technology display at Stand 2 in the exhibition area. Featured technologies include Dow Corning Architectural Insulation Modules, crystal-clear bonding solutions and high-performance structural glazing solutions. Event delegates are invited to arrange one-on-one business meetings.

To learn more about Dow Corning Architectural Insulation Modules, visit dowcorning.com/HPInsulation. Information about Dow Corning's full range of silicon-based materials for high-performance building solutions is available at dowcorning.com/construction.

Source: http://www.dowcorning.com/

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