Research and Markets has announced the addition of the "Global Electronic Packaging Market 2014-2018" report to their offering.
The analysts forecast the Global Electronic Packaging market will grow at a CAGR of 46.79 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing thefts and counterfeiting practices. The Global Electronic Packaging market has also been witnessing a rising number of innovations. However, lack of awareness about the potential of electronic packaging could pose a challenge to the growth of this market.
The key vendors dominating this space are BASF SE, Enfucell Ltd., MeadWestvaco Corp., Soligie Inc., and T-Ink Inc.
The other vendors mentioned in the report are Acreo Swedish ICT, Blue Spark Technologies, Canatu Ltd., Cap-XX Ltd., Cymbet Corp., Excellatron Solid State LLC, Fraunhofer Institute for Electronic Nano Systems, Front Edge Technology Inc., Holst Centre, Infinite Power Solutions Inc., Infratab Inc., Institute of Bioengineering and Nanotechnology , ISORG, Kovio Inc., Massachusetts Institute of Technology, NEC Corp., Novalia Ltd., Plastic Logic Ltd., PragmatIC Printing Ltd., Printechnologics GmbH, PST Sensors, Solarmer Energy Inc., The Universidade Nova de Lisboa, Thin Film Electronics ASA, and VTT Technical Research Centre of Finland
Commenting on the report, an analyst from the team said: The rapid investments in R&D activities by vendors and technological advancements in electronic packaging have resulted in a rising number of new innovations in product packaging. From talking pizza boxes to winking wine bottles, from sensor labels to solar bags and light emitting displays with audio, all are classic examples of innovations in this market. These advancements have forced the manufacturers to differentiate their products from others in this highly competitive market, attract consumers, reduce theft and counterfeiting, and build a brand in the market. Also, such innovations act as a major tool for improving product performance, reliability, and functionality in electronic packaging.
For more information visit http://www.researchandmarkets.com/research/6rxm4t/global_electronic