Leti is a pioneer and leader in MEMS research and development for sensors and actuators. Building on more than 30 years of MEMS R&D, Leti continues to focus on innovative sensor technologies.
The most advanced is its M&NEMS technology platform based on detection by piezo-resistive silicon nanowires, which reduce sensor size and improve performances of multi-axis sensors. Leti’s inertial-sensor manufacturing concept enables the design and fabrication of combo sensors, such as three-axis accelerometers, three-axis gyroscopes and three-axis magnetometers on the same chip. This is a key component for Internet of Things (IoT) applications.
Leti’s M&NEMS concept, developed with 200mm technology, is currently being transferred to an industrial partner. Demonstration of this technology on 300mm wafers has shown very promising results.
In addition to lowering costs, manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias (TSV), which is already available in 300mm technology.
Jean-René Lèquepeys, head of Leti’s Silicon Components Division, will present the latest results in Leti’s MEMS technology R&D at the European MEMS Summit 2015, Sept. 17-18 in Milan, Italy.