Indium Corporation continues to innovate alloy technologies with a new high-performance, high-reliability low-temperature alloy.
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210 °C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse LT:
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications