GE Plastics Introduce Low Cost High Performance Polymer Film for Electronics Applications

For electrical/electronics (E/E) manufacturers that previously faced the dilemma of choosing between the high cost of specifying polyimide (PI) to achieve desired performance, or downgrading an application by using lower-performing polyethylene napthalate (PEN) or polyester (PET), there is now a solution. New Ultem* 5000B film from GE Plastics offers excellent high performance coupled with cost-effectiveness. Based on GE’s Ultem polyetherimide (PEI) resin, this material’s high temperature and flame resistance, low moisture absorption, and excellent dielectric properties make it an excellent candidate for E/E applications such as insulating tapes and laminates, diaphragms and voice coils for loudspeakers, high temperature bar code labels, and flat flexible heaters. Ultem 5000B film is available in black and amber and in gauges 25m - 750m.

“This new GE film is what the market has been waiting for,” said Max Cattani, GE industry manager for high-performance E/E films, Europe. “Ultem 5000B film gives E/E manufacturers a combination of high performance and cost-effectiveness – reducing the need to overspecify materials or compromise on properties. And this new grade is highly versatile in terms of processing and range of potential applications.”

The following are the key high-performance properties of Ultem 5000B film:

  • Flame retardance: UL-94 VTM-0 listed compared to VTM-2 for standard grades of PET and PEN
  • RoHS/WEEE compliance for environmental regulations
  • Lower moisture absorption vs. PI and Aramid Paper, enabling the film to be used in motors or generators in high-humidity environments
  • Thermal class H allowing Ultem 5000B film to be used in higher-temperature insulating systems
  • Better dimensional stability than PET and PEN, making the lamination process easier

The new GE film offers a wide choice of processing, including thermoforming, drilling, die-cutting, cold-forming, laminating, metal sputtering, and ultrasonic welding. It is heat-sealable to itself and other materials. In contrast, PI standard grades cannot be thermoformed and Aramid Paper releases dust during some processes.

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