High Quality X-Ray Images for Radiation and Security with First Sensor

Airports and sea ports use inspection and security systems such as baggage scanners, cargo scanners and container scanners to screen and inspect baggage, freight and vehicles.

Photodiodes and Sensor Systems for Container and Cargo Scanners.

Photodiodes and Sensor Systems for Container and Cargo Scanners. Image Credit: First Sensor

A range of photodiodes and sensor systems are offered by First Sensor for measuring ionizing radiation directly through the absorption in the crystal lattice or indirectly through the measurement of the luminescence radiation of a scintillation crystal.

Large Detector Arrays for X-ray Inspection of Baggage and Freight.

Large Detector Arrays for X-ray Inspection of Baggage and Freight. Image Credit: First Sensor

Freight Inspection Systems and Baggage Scanners

Cargo scanners and container scanners are some examples of freight inspection systems that screen and check cargo and vehicles in container terminals, in sea ports and at border crossings. Mobile freight inspection systems can be easily and flexibly installed at the area of application, and stationary drive-through systems can be used for higher throughputs at a fixed location.

Freight inspection systems have an output of up to 6 MeV and can penetrate steel up to 30 cm thick. Baggage scanners and freight inspection systems are used in airports use to perform X-ray inspection of freight and baggage. X-ray scanners are also used in warehouses, forwarding agents and logistics companies.

Sensor Solutions for Freight Inspection Systems and Baggage Scanners

Precision detectors are necessary for high-quality X-ray images with highly detailed resolution. First Sensor offers photodiodes that have very low dark current and low capacitance capabilities, thus allowing low-noise X-ray images with very high contrast.

The X7 PIN photodiodes from First Sensor are optimized for scintillator luminescence radiation in the visible wavelength range and also include an ultra-flat design (chip-scale package). The new flip-chip technology is used to mount the chip on the carrier, with its active area and the contacts facing down. The chip is then illuminated from the back. This results in a flat chip surface without delicate bond wires, which is suitable for the precision mounting of a scintillation crystal.

Using surface mount technology (SMT) and solder bumps, multiple X7 photodiode elements can be assembled to produce larger matrix or linear arrays with excellent fitting accuracy.

First Sensor also develops and manufactures sensors, custom specific arrays and complete systems for OEM Manufacturers of baggage scanners and freight inspection systems across the world.

Products include:

  • Series 7: Fully depletable IR photodiodes
  • Series X: Detectors for ionizing radiation
  • SiPM: Silicon photomultipliers for ultra-low light levels
  • Customized sensors, modules and arrays

This information has been sourced, reviewed and adapted from materials provided by First Sensor AG.

For more information on this source, please visit First Sensor AG.

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