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H.C. Starck’s Bonded Sputtering Targets Displayed at FPD China 2016

Oxford Instruments Launches Unique HERO™ Window For Reliable Hot Sample XRF Analysis

Oxford Instruments Launches Unique HERO™ Window For Reliable Hot Sample XRF Analysis

First Experimental Observation of Isostructural Solid-Solid Transition at Single-Particle Level

First Experimental Observation of Isostructural Solid-Solid Transition at Single-Particle Level

Pittcon 2016 in Atlanta, Another Success Story

Pittcon 2016 in Atlanta, Another Success Story

HORIBA Scientific Announces New Software for its ICP-OES Spectrometers

Study Uncovers Important Clues on Promising Energy Storage Material

Study Uncovers Important Clues on Promising Energy Storage Material

Innovative Device to Analyze Molecular Interactions in Viscous Solutions and Fragile Materials

Innovative Device to Analyze Molecular Interactions in Viscous Solutions and Fragile Materials

Optomec Secures Multiple Orders for Aerosol Jet 5X Printing System

Optomec Secures Multiple Orders for Aerosol Jet 5X Printing System

Roadmap for Design and Application of Next-Generation Additive Manufacturing Materials Released by Penn State

Roadmap for Design and Application of Next-Generation Additive Manufacturing Materials Released by Penn State

Next Generation Hydrogen Gas Detector Developed by Storage Battery Systems

Researchers Explore Ways to Extract Rare Earth Minerals from Coal

Researchers Explore Ways to Extract Rare Earth Minerals from Coal

New Cleaning Mechanism Enables Repetitive Measurements up to 200 Times

New Cleaning Mechanism Enables Repetitive Measurements up to 200 Times

New Cleaning Mechanism Enables Repetitive Measurements up to 200 Times

New Cleaning Mechanism Enables Repetitive Measurements up to 200 Times

New Technique Allows Real-Time Monitoring of Atomic Changes Occurring at Material’s Surface

New Technique Allows Real-Time Monitoring of Atomic Changes Occurring at Material’s Surface

CPI Announces new Roll to Roll Slot Die/Screen Printing and Encapsulation Capability

CPI Announces new Roll to Roll Slot Die/Screen Printing and Encapsulation Capability

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