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NIST Announces Competition to Create Advanced Materials Center of Excellence

The National Institute of Standards and Technology (NIST) has announced a competition to create an Advanced Materials Center of Excellence to foster interdisciplinary collaborations between NIST researchers and scientists and engineers from academia and industry. The new center will focus on accelerating the discovery and development of advanced materials through innovations in measurement science and in new modeling, simulation, data and informatics tools.

1 Jul 2013

US Demand for High Temperature Plastics Forecast to Reach $3.1 Billion in 2017

Reportlinker.com announces that a new market research report is available in its catalogue: US High-Temperature Plastics Market

From Report Linker 29 Jun 2013

Researchers Discover New Physical Organogel Electrolyte with Two Unique Characteristics

A research team at Ulsan National Institute of Science and Technology (UNIST), S. Korea, found a new physical organogel electrolyte with two unique characteristics: an irreversible thermal gelation and a high value of the Li+ transference number.

29 Jun 2013

OPEL Achieves Milestone 6 in Development of Planar Optoelectronic Technology Platform

OPEL Technologies Inc. (“OPEL” or “the Company”) announces that it has achieved Milestone 6 in its development roadmap of the proprietary planar optoelectronic technology (POET) platform for monolithic fabrication of integrated electronic and optical devices on a single semiconductor wafer, a next-generation alternative to silicon complementary metal-oxide semiconductor (CMOS) technology..

29 Jun 2013

New Broad-Ranging Report on Supercapacitors and Supercabatteries

Reportlinker.com announces that a new market research report is available in its catalogue: Electrochemical Double Layer Capacitors: Supercapacitors 2013-2023

From Report Linker 29 Jun 2013

Indium Introduces SACM High-Reliability Solder Alloy with Superior Drop Shock Performance

Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.

29 Jun 2013

ON Semiconductor Awarded 2012 Total Cost of Ownership Supplier Award from Celestica

ON Semiconductor Corporation today announced it has been awarded a 2012 Total Cost of Ownership (TCOOTM) Supplier Award from Celestica, a global leader in the delivery of end-to-end product lifecycle solutions. Celestica’s awards program recognizes suppliers that support Celestica’s TCOO strategy and demonstrate excellence in quality, delivery, technology, service, pricing and flexibility.

28 Jun 2013

BASF Introduces Blow-Molding Grade of Ultramid Endure Polyamide-Based Injection-Molding Material

In a few months, the strict limits laid down by the Euro 6 exhaust gas standard will become reality. Depending on the kind of vehicle they demand considerable reductions when it comes to the nitrogen oxide and hydrocarbon emissions as well as the soot particles.

From BASF Corporation 28 Jun 2013

ThyssenKrupp Expands Research and Development Project for Innovations in Automotive Engineering

InCar® is now InCar®plus! Under the motto “Solutions for automotive efficiency”, ThyssenKrupp’s biggest ever research and development project for innovations in automotive engineering is being expanded.

28 Jun 2013

Hydrogen Fuel Cells Can Provide Emissions-Free Energy for Anchored Ships

Providing auxiliary hydrogen power to docked or anchored ships may soon be added to the list of ways in which hydrogen fuel cells can provide efficient, emissions-free energy.

From Sandia National Laboratories 28 Jun 2013

BASF Expands Glass Fiber-Reinforced PA610 Line of Injection Molding Products

Since BASF introduced the first glass fiber-reinforced PA610 injection molding grades of Ultramid® S Balance at the K 2010 Plastics Trade Show, the material has found use in numerous applications because of its special characteristics. Because of the current demand in the market and on the basis of its years of experience in extrusion, BASF decided to expand its PA610 line of products.

From BASF Corporation 28 Jun 2013

Schrödinger Partners with USC Professor to Develop Organic Semiconductor Materials

Schrödinger Inc., a technology leader in atomic-scale modeling and physics-based chemical simulations, and Dr. Mark E. Thompson, Professor of Chemistry at the University of Southern California, announced today their joint research collaboration to advance the development and design of organic semiconductor materials through use of atomic-scale simulations.

28 Jun 2013

3D Systems to Assist Planetary Resources in Developing Components for ARKYD Series Spacecraft

3D Systems and Planetary Resources, Inc. announced today that 3D Systems has joined Planetary Resources' core group of investors and will be a collaborative partner in assisting Planetary Resources to develop and manufacture components of its ARKYD Series of spacecraft using its advanced 3D printing and digital manufacturing solutions.

From 3D Systems 28 Jun 2013

Increasing Investments in Automotive Sector may Boost Mexican Engineering Plastics Market

Reportlinker.com announces that a new market research report is available in its catalogue: Analysis of the Engineering Plastics Market in Mexico

From Report Linker 28 Jun 2013

Schäfter+Kirchhoff Introduces USB 3.0 Line Scan Cameras for Surface Inspection Applications

As a traditional manufacturer of line scan cameras Schäfter+Kirchhoff introduce their new USB 3.0 line scan camera series. The range of these USB Superspeed line scan cameras includes monochrome, color or TDI sensors with 512to 8160 pixels (monochrome) or up to 3x 7600 pixels (RGB).

From Schäfter + Kirchhoff GbmH 28 Jun 2013

Materials Science News

NIST Announces Competition to Create Advanced Materials Center of Excellence

US Demand for High Temperature Plastics Forecast to Reach $3.1 Billion in 2017

Researchers Discover New Physical Organogel Electrolyte with Two Unique Characteristics

OPEL Achieves Milestone 6 in Development of Planar Optoelectronic Technology Platform

New Broad-Ranging Report on Supercapacitors and Supercabatteries

Indium Introduces SACM High-Reliability Solder Alloy with Superior Drop Shock Performance

ON Semiconductor Awarded 2012 Total Cost of Ownership Supplier Award from Celestica

BASF Introduces Blow-Molding Grade of Ultramid Endure Polyamide-Based Injection-Molding Material

ThyssenKrupp Expands Research and Development Project for Innovations in Automotive Engineering

Hydrogen Fuel Cells Can Provide Emissions-Free Energy for Anchored Ships

BASF Expands Glass Fiber-Reinforced PA610 Line of Injection Molding Products

Schrödinger Partners with USC Professor to Develop Organic Semiconductor Materials

3D Systems to Assist Planetary Resources in Developing Components for ARKYD Series Spacecraft

Increasing Investments in Automotive Sector may Boost Mexican Engineering Plastics Market

Schäfter+Kirchhoff Introduces USB 3.0 Line Scan Cameras for Surface Inspection Applications

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