Research and Markets has announced the addition of the "Aluminum Die Castings - Global Strategic Business Report" report to their offering.
Joining Technologies, Inc., an innovator in industrial laser applications, announces that it has expanded its additive manufacturing capabilities to include internal diameter(ID) cladding. Together with its partners Fraunhofer ILT, Pallas Oberflaechentechnik GmbH & Co KG and Laserline, Inc.,Joining Technologies has installed a specialized ID cladding station.
Rudolph Technologies, Inc. (“Rudolph” or the “Company”), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today that it has entered the back-end advanced packaging lithography market with the new JetStep™ Lithography System, a disruptive innovation featuring a 2X reduction stepper.
Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®.
Dow Epoxy, a business unit of The Dow Chemical Company, completed its 30 KTA Liquid Epoxy Resin (LER) expansion at its fully back-integrated Stade, Germany site. The facility, which has now been ramped up to full production rates, will increase the Company’s global LER capacity by 10 percent. This will improve the reliability of Dow’s supply chain and epoxy assets, allowing Dow to better serve its customers and to continue to grow with the marketplace.
To date, it has been very laborious to manufacture fiber-reinforced composites with a thermoplastic matrix in large quantities. On the one hand, the textile-like dense continuous fiber-reinforced structures are difficult to shape, on the other, joining the continuous fibers with a highly viscous thermoplastic matrix material is a highly complex process. To date, there is no economically profitable production technology for large-volume component series.
The annual printed electronics award winners were announced at the IDTechEx Printed Electronics event this week in Santa Clara, California - the World's largest event on the topic.
Instron, a leading provider of testing equipment solutions designed to evaluate mechanical properties of materials and components, introduces the BioCoat: a polyurethane protective cover designed for Instron® Series 5940 single column testing systems.
Angstron Materials has received United States patent 8,114,373 for its next-step method that effectively exfoliates layered graphene and offers several key advantages. The method is able to produce nano graphene platelets with a thickness thinner than 100nm and in many cases thinner than 10 nm or as thin as 0.34 nm to 1.02 nm. This method allows the NGP material to be used in applications ranging from bucky paper, mat, thin film and lamina to nanocomposites.
A few months ago, FBW GmbH, a plastics compounding specialist in Niederzier/Germany, put into successful operation two STS 35 advanced Standard Twin Screw Compounders from Coperion GmbH, Stuttgart. Equipped with 35 mm diameter screws, these compounders have since been producing a whole range of high-grade pigment and additive masterbatches, mainly in small and medium-sized batches, i.e. in sizes ranging between 25 and 300 kg.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.