Silicon Quest International (SQI) and Topsil Semiconductor Materials are pleased to announce the signing of an agreement for sole U.S. distribution of Topsil Float Zone products, ranging from gas phase doped products to ...
RPO Pty Ltd, an innovator in polymer optical materials and waveguides, announced today it has secured AUD2.5 million in a Series A round of financing.
This round of funding was well-supported and led by repeat invest...
3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 2...
Secretary of Energy Spencer Abraham today announced a new phase of fuel-cell research designed to hasten the wider availability of zero-emissions energy. Eleven new projects with total value of nearly $4.2 million, inclu...
IBM scientists have achieved a breakthrough in nanoscale magnetic resonance imaging (MRI) by directly detecting the faint magnetic signal from a single electron buried inside a solid sample.
This achievement is a majo...
Nitronex Corporation, a pioneer in the development of Gallium Nitride (GaN) on Silicon technology, is pleased to announce it is now offering GaN epitaxial wafers for sale. By offering access to its material platform tech...
The computing community for many years has longed to be able to carry out high speed calculations using a genuine Quantum Computer because it would facilitate the practical factorisation of very large numbers and the sea...
Akzo Nobel Coatings’ Industrial finishes business this week officially opened two new multi-purpose coatings sites in China.
Located in Tianjin, 80 miles from Beijing, and Jiashang, which is in the vicinity of S...
3M today introduced an innovative high-performance diamond pad conditioner - the 3M Diamond Pad Conditioner A4-55 - for oxide chemical mechanical planarization (CMP) that upholds 3M's commitment to quality, while off...
3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 2...
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