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Applied Materials Launches New Smart Platform for Chip Manufacturing

Applied Materials Launches New Smart Platform for Chip Manufacturing

Applied Materials Releases New Silvia System to Reduce TSV Fabrication Cost

STATS ChipPAC Expects Copper Wire Bond Production to Increase 75%

STATS ChipPAC Expects Copper Wire Bond Production to Increase 75%

SCI Engineered Materials Receives Final Approval for 7-Year Loans to Meet Solar Growth

Amtech Systems Receives $68 Million in New Solar Orders for Diffusion Technology

Applied Materials Ties Up Deal with Samsung Electronics

Dow Corning to Present Silicone Tubing Innovations at CPhI India Conference

Dow Corning to Present Silicone Tubing Innovations at CPhI India Conference

2010 Market Analysis on Wet Chemicals for Semiconductor Device Processing

Kyocera Wins 2010 Supplier Award from Amkor Technology

Kyocera Wins 2010 Supplier Award from Amkor Technology

HELIOS Project to Accelerate Commercialization of Silicon Photonics in Europe

HELIOS Project to Accelerate Commercialization of Silicon Photonics in Europe

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