Ultrasonic Systems, Inc. (USI), the leading manufacturer of high-performance ultrasonic spray coating equipment for the solar, semiconductor, and fuel cell markets, announces the availability of a heated vacuum chuck option for the Prism spray coating system.
Poly Plant Project, Inc. (PPP), a worldwide provider of advanced polysilicon production process technology and polysilicon production equipment solutions used to produce high-purity polysilicon for the solar industry and semiconductor industry, today announced that it has received an order for its TCS based polysilicon production process technology and key equipment from Baotou City Shansheng New Energy Co., Ltd.
The weather outside may be frightful, but this furnace will raise temperatures in Professor Mawby's lab to a blistering 1800oC, 500oC higher than traditional silicon furnaces. It will be used to make Power Semiconductor devices in Silicon Carbide, a material which is revolutionizing electrical energy management.
Veeco Instruments Inc. (Nasdaq: VECO), announced today that it has shipped its 200thTurboDisc(R) K465i(TM) Metal Organic Chemical Vapor Deposition (MOCVD) System to a leading LED manufacturer located in Asia.
"W...
Research and Markets has announced the addition of the "Silicon and Ferro Silicon - Global Strategic Business Report" report to their offering.
This report analyzes the worldwide markets for Silicon and Fer...
SPP Process Technology Systems (SPTS), a supplier of advanced capital equipment and process technologies for the global semiconductor and related markets, today announced an order win for its Sigma fxPTM PVD system from ...
FUJIFILM Corporation (President and CEO: Shigetaka Komori) has acquired, through its semiconductor material manufacturing and marketing subsidiary FUJIFILM Electronic Materials U.S.A., Inc., 50% membership interests in dedicated CMP slurry manufacturer Planar Solutions, LLC (Headquartered in Michigan, U.S.; “Planar” hereinafter), held by Wacker Chemical Corporation (Headquartered in Munich, Germany; “Wacker” hereinafter).
Applied Materials, Inc. today begins a new era in chip manufacturing with its powerful Applied Centris(TM) AdvantEdge(TM) Mesa(TM) Etch, the smartest, fastest silicon etch system ever made for the volume production of the world's most advanced memory and logic chips.
Applied Materials, Inc. today revealed its latest innovations in through-silicon via (TSV) etch technology on its Applied Centura® Silvia(TM) Etch system.
A new plasma source boosts the silicon etch rate by over 4...
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") a leading semiconductor test and advanced packaging service provider, today announced it has shipped over 100 million semiconductor packages with copper wire bond interconnect and expects copper wire bond production volume to grow another 75% by the end of 2010 due to a rapidly growing customer base.
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