FSI International, Inc., a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that it has received an order for its ORION single wafer processing system from a second major semiconductor foundry based in Asia.
Since 2007 the Schunk Group has committed euro 65 million of capital investment in response to business growth in high-temperature applications. In the biggest plant expansion in its history, the company has added a...
Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand, according to the report “Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis Of The Technical, Economic, and Political Issues”.
Alchimer S.A., a leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), today announced a groundbreaking advance for filling narrow, high-aspect-ratio TSVs while significantly reducing the need for chemical components in the metallization process.
Dow Electronic Materials, a business unit of Dow Advanced Materials, today announced a multi-phase plan to expand their TrimethylGallium (TMG) production capacity to meet the surging global demand for the material in the electronics market.
SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will highlight current research through a wide range of lectures and workshop sessions from July 13-15, in conjunction with SEMICON West 2010 in San Francisco, CA.
Philips Lumileds has donated a metal-organic chemical vapor deposition (MOCVD) system for the synthesis of high-quality semiconductor materials to the Baskin School of Engineering at UC Santa Cruz.
Oerlikon Systems, a leading supplier of PVD sputter systems, has received a multiple tool purchase order from the world’s largest semiconductor foundry for its CLUSTERLINE 300II systems.
Leading high purity, semiconductor seals specialist, Perlast Ltd, a unit of IDEX Corp., is further lowering the cost-of-ownership of Etch and chemical vapor deposition (CVD) process equipment with the launch of new ...
Unisem today announced the introduction of a new high density leadframe packaging technology, the Leadframe Grid Array (LFGA). This latest offering, developed by TL Li, the founder and major shareholder of QPL Inter...
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