Bemis and Thin Film Electronics Ink Joint Development Agreement

Bemis and Thin Film Electronics have reported that they have inked a joint contract to make a Bemis intelligent packaging platform. This joint agreement will expedite the commercial growth of functional sensor labels.

Newly emerging printed electronic technology is used to manufacture these sensor labels. This technology was developed from Thin Film’s own program logic and read or writable printed memory.

When utilized with Bemis packaging platform, ecological information and main physical properties in packaged perishable products will be monitored and documented by the product line of “intelligent” sensor labels.

Bemis’ CEO and President, Henry Theisen stated that intelligent packaging platform is the latest technology having numerous possible intersections with the company’s pressure sensitive materials and flexible packaging business sectors. The agreement signed with Thin Film is a technological investment, and would result in the usage of printed electronics component in every package.

Bemis is planning to launch its intelligent packaging platform in 2014.

Wisconsin-based Bemis provides pressure sensitive materials and flexible packaging that are utilized in consumer products, food, healthcare, and other companies. The flexible packaging business of the company has a robust technical base in coating and laminating, film extrusion, polymer chemistry, printing, and converting.

Thin Film Electronics is a developer of printed electronics. The company’s printed system products contain sensing, memory, and wireless communication. Its headquarters are located in Norway and Sweden.

Source: http://www.bemis.com/

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