Arradiance Receives Order for ALD/CVD Combination Tool for Advanced Metal Deposition Research

Arradiance Inc., announced today the receipt of an order for the industry’s first benchtop ALD/CVD combination tool for advanced metal deposition research.

New system’s features minimize contamination and maximize process control. Capable of processing 200mm substrates using up to eight precursors, this new GEMStar system has the ability to achieve process temperatures of up to 400⁰C in either a pulsed or continuous controlled flow mode to offer the highest quality metal films available for researchers.

“This unique GEMSTAR-8 system combines the control of Atomic Layer Deposition with the speed and versatility of CVD in a compact benchtop unit perfect for material development in a controlled temperature (400°C) and gas processing environment,” said David Beaulieu, Arradiance Chief Operating Officer. “Metal deposition is of particular interest in markets such as semiconductors and alternative energy. Materials research in this area could lead to less expensive and more abundant energy in the future.”

Since entering the market in 2009, GEMStar has become the preferred laboratory tool for serious researchers who need quality ALD at an affordable price. The system has been adopted at major US and International research institutions around the world.

“Our unique experience and ground-breaking work with our patented ALD-activated, large area microchannel plates along with expertise in materials science, systems engineering and product development have all combined to make possible a truly robust research ALD system for scientists and engineers who are serious about results,” says Ken Stenton, Arradiance CEO. “Because of the demand for expanding the materials that can be deposited using ALD we saw the need for a research tool with excellent film performance and system reliability at a size and cost to fit the research environment. We’re confident the GEMStar-8 will exceed customer expectations.”

Demand for high quality, precisely controlled metal deposition into higher aspect ratio structures is increasingly called for by the semiconductor industry to enable the smaller geometries of future chip generations.

Source: http://www.arradiance.com/

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