New from Intertronics comes Polytec EC 275 which further extends their portfolio of specialist high performance conductive adhesives.
Polytec EC 275 has innovative specialist fillers which deliver excellent electrical conductivity (1x 10-3 – 7.5x10-4 Ω-cm) within a low cost, two component formulation for applications in electronics, micro-electronics, opto-electronics, hybrids and sensor technology.
Polytec EC 275 can be used for IC packaging, connecting circuits to copper coils (RFIDs or smart cards) and EMI/RF shielding. The paste-like adhesive can be easily applied with various dispensing techniques or screen printing and is available either as two components or premixed and frozen in syringes.
Explained Intertronics M.D. Peter Swanson: “Polytec EC 275 utilises nickel free fillers not based on silver flake to create an electrically conductive performance appropriate for die attach, SMD bonding, RFID antennas, and EMI/RFI shielding applications. Polytec EC 275 is substantially less expensive than conventional silver loaded adhesives, which are subject to volatile precious metal markets, but still offers comparable electrical performance.”
Polytec EC 275 is easy to process due to convenience packaging, and it has a pot life of two days at room temperature, thus conferring process flexibility while minimising waste.