Posted in | Electronics

Advantech Releases Intel Core i7-3500 Mobile Processor Based 6U Compact Single Board Computers

Advantech today announced the availability of the MIC-3395MIL, a ruggedized 6U Compact Single Board Computer (SBC) based on the Intel® Core™ i7-3500 mobile processor series. This new addition to the MIC-3395 family combines ultra-low voltage multicore processors with very low power dissipation and a highly conductive aluminum heat sink to eliminate the need for on-board forced ventilation.

Ruggedized requirements are satisfied by its conduction cooled design and allow it to meet extended operating temperatures of -40°C to 70°C necessary for use in military and defense, aerospace and transportation applications among others.

The shock and vibration resistance of the board is increased by the use of wedge locks fitted toa single-piece CNC-milled aluminum alloy heat sink plate which also provides a low impedance thermal path between the board and the chassis. Optional conformal coating can also be applied to act as protection against moisture, dust, and chemicals that could result in damage or failure if non-protected.

The MIC-3395MIL is based on the same design as the standard MIC-3395, enabling customers concerned with R&D OPEX to begin application code development on the commercial variant before migrating to the MIC-3395MIL for final test and integration. A unique rear transition module, the RIO-3395MIL-A1E provides extra connectivity to the main SBC.

The MIC-3395’s field proven commercial design coupled with its rugged features make the board particularly suitable for Command, Control, Communication, Computing, Intelligence, Surveillance and Reconnaissance (C4ISR) solutions where reliable operation in extremes of operating temperature, shock, vibration and corrosiveatmospheres is vital.

Onboard soldered DRAM with ECC support and optional memory expansion extends the memory to a maximum of 16 GB to enhance reliability and support for demanding applications in high performance or virtualized environments. The dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory throughput. Combined with the powerful Intel QM67 chipset, the processor offers high throughput I/O performance by leveraging 5GT/s DMI and PCIe interfaces.

An onboard XMC/PMC site with PCIe x8 gen.2 connectivity is able to host high speed offload or I/O mezzanines. Special heat sink design to accommodate specific mezzanine cards from Advantech or the PICMG ecosystem can be studied upon request. With SATA-III support and up to 6Gbps I/O, the latest enhancements in storage technology such as high speed SSDs can be employed. Six (Gigabit Ethernet)[pm1] ports for PICMG 2.16, front and rear connectivity ensure best in class network connectivity. The processor’s integrated enhanced graphics engine (HD3000/HD4000) and dual independent display support, make the MIC-3395MIL an ideal fit for demanding military workstation or imaging applications.

The processor implements Intel® Advanced Vector Extensions (AVX), providing a set of instructions for executing Single Instruction Multiple Data (SIMD) operations to enhance real-time signal and image processing capabilities. AVX accelerates overall compute performance in CPU intensive applications that involve image, audio & video processing and analysis. Support for 16-bit floating-point data type is ideal for more compact data representation than the single precision floating-point format particularly in applications where reduced dataset size and memory bandwidth consumption are key. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3395MIL a highly available and reliable computing engine.

TheMIC-3395MIL also supports an onboard 2.5” Serial ATA HDD or SSD, a CFast slot, an optional onboard, soldered NAND flash and a set of I/O functions brought through the backplane to the rear transition module. The RIO-3395MIL transition module expands connectivity to two GbE LANs, one P/S2, one COM (RJ45), one COM (D-Sub9), two USB, one DVI and one VGA connector. Two additional transition modules with different I/O combinations are available for the non-conduction cooled variants of the board and can be adapted to meet more ruggedized needs upon request.

The board is available for customer sampling today.
For more information please contact [email protected] or visit


Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback