Epoxy MC; Fire Retardant; Mineral and Glass Fibre Reinforced

Advantages

Highest oxygen index (~35%) and lowest mould shrinkage compared with other epoxy moulding compounds.

Disadvantages

Tendency to stick in mould. Lowest elongation at break compared with other epoxy moulding compounds.

Typical Properties

Property

Value

Density (g/cm3).

1.9

Surface Hardness

RM115

Tensile Strength (MPa)

60

Flexural Modulus (GPa)

12

Notched Izod (kJ/m)

0.02

Linear Expansion (/°C x 10-5)

2.5

Elongation at Break (%)

0.6

Strain at Yield (%)

N/A

Max. Operating Temp. (°C)

130

Water Absorption (%)

0.2

Oxygen Index (%)

35

Flammability UL94

V0

Volume Resistivity (log ohm.cm)

14

Dielectric Strength (MV/m)

14

Dissipation Factor1kHz

0.01

Dielectric Constant  1kHz

4

HDT @ 0.45 MPa (°C)

260+

HDT @ 1.80 MPa (°C)

200

Material Drying  hrs @ °C

NA

Melting Temp. Range (°C)

60 -  80

Mould Shrinkage (%)

0.3

Mould Temp. Range (°C)

160 - 190

Applications

Encapsulation of electronic and electrical devices for electrical insulation, physical protection and protection against moisture. E.g. Chokes, capacitors, resistors, transformers, printed circuits, electronic modules.

 

Source : Abstracted from Plascams

For more information on Plascams please visit The Rubber and Plastics Research Association

 

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